From May 8 to 10 at SMT 2012, booth 6-406, Finetech will present new developments and improvements for the hot gas rework station FINEPLACER® core.
At SMT 2012 on booth 6-406 Finetech will present the latest rework and bonder generation FINEPLACER® matrix.
Intel® Corporation has recognized Finetech with an Appreciation Award presented by Intel’s Equipment Vendor Enabling program.
Finetech announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its FINEPLACER® matrix ma.
On September 29, Finetech was pleased to welcome assembly & bonding professionals from Germany and Europe to the Berlin headquarters...
May 21-23, 2012Location: Santa Fe, NMBooth: tba.On display: tba.
Sep 6-9, 2012Location: Shenzhen Convention & Exhibition CenterBooth: tba.On display: tba.
Sep 11-13, 2012Location: San Diego, CABooth: tba.On display: tba.
Sep 16 - 20, 2012 Location: Amsterdam (NL)Booth: tba.On display: FINEPLACER® lambda
Sep 25, 2012 Location: Paul Scherrer Institut, Villigen (Schweiz) On display: FINEPLACER® lambda, FINEPLACER® femto...
Sep 27, 2012 Location: RAFI Schulungszentrum, Weingarten (BaWü) On display: FINEPLACER® core and more...
Oct 16-17, 2012Location: Orlando, FLBooth: tba.On display: tba.
Надёжный метод для монтажа перевёрнутых кристаллов, не нуждающийся в соединительных проводах..
Часто ремонт BGA используется, как синоним для ремонта всех технологий поверхностного монтажа (SMT)...